Cardlite LITE 2402 is a solvent-free, low-viscosity phenolic amine curing agent suitable for liquid epoxy resin systems and epoxy fibers that cure at room temperature and moderate temperatures. Reinforced composite materials. This product features low odor, excellent fiber wettability, water resistance, acid and alkali resistance, and a long shelf life, making it suitable for various production processes.

JEFFAMINE® D-220 Polyetheramine is a difunctional, primary amine with repeating oxypropylene units in the backbone. 

ETHYLENEAMINE EA-300 is a polyamine mixture of tetraethylenepentamine (TEPA) and higher molecular weight ethyleneamine products containing linear, cyclic and branched products with a numberaverage molecular weight of about 270 g/mole

Trigonox® C tbpb(tert butyl peroxybenzoate) may be used for the (co)polymerization of styrene in the temperature range of 100-140°C. In practice, combinations of two or more peroxides with diverging activities are used to reduce the residual monomer content in the final polymer and to increase reactor efficiency. Trigonox® C tbpb(tert butyl peroxybenzoate) is also an efficient initiator for the ethylene polymerization at high pressure in both autoclave and tubular processes. To obtain a wide spectrum of polymerization temperatures, Trigonox® C tbpb(tert butyl peroxybenzoate) is often used in combination with other peroxides. Depending on reaction conditions, Trigonox® C is active in the temperature range of 220-270°C.

Ketjenblack EC-300J is a pure electroconductive carbon black extremely suitable for antistatic and electroconductive applications.

Ketjenblack EC-600JD is a pure electroconductive carbon black extremely suitable for antistatic and electroconductive applications.

H100 sealant tape is designed for the pre-pumping process of composite material forming, with high strength and high toughness, can be repeatedly deformed at room temperature, can be used at the process temperature below 248°F (120°C), can be easily stripped from the mold after use, reducing the waste of 248°Fprocess time.

LOCTITE® FREKOTE 770-NC™ offers excellent release for various molding applications.

LOCTITE® FREKOTE 700-NC™ offers excellent release properties for the most demanding applications and is a great all-purpose release agent. LOCTITE® FREKOTE 700-NC™  releases epoxies, polyester resins, thermoplastics, rubber compounds and most other molded polymers.

LOCTITE® Frekote PMC™ is a special blend of solvents designed to dissolve and remove wax from polyester molds without dulling the surface. This product can also be used to clean epoxy and metal mold surfaces as well as for cleaning brushes and equipment.

LOCTITE® Frekote WOLO™ is a unique, low VOC polymer release agent that cures quickly and provides multiple release of all polyester resins. Applications and use of a release agent has never been easier, simply wipe on and leave on to produce a high gloss finish with no need to polish.

Trigonox® HMa is a methyl isobutyl ketone peroxide (MIBKP) formulation for curing unsaturated polyester resins as such or in the presence of a cobalt accelerator in the temperature range of 60-150°C.

Diethylenetriamine (DETA) is an aliphatic ethylene amine with two primary and one secondary amine groups. DETA is a clear, colorless liquid. Typical application areas of DETA include chelating agents, wet-strength resins, lubricant oil additives, oil field chemicals and polyamides for resins or epoxy curing agents.

LOCTITE® FREKOTE FMS™ is formulated specifically as a sealer for fiberglass reinforced polyester, epoxy and other composite molds commonly used in the fiberglass molding industry.

LOCTITE® 55™ is a general purpose, threaded pipe and fitting sealant which is wound from the dispensing package onto the threads of the pipe. It is supplied in containers, which serve for both storage and dispensing purposes. Recommended for sealing metal and plastic tapered pipe threads and fittings 4" NPT (National Pipe Thread) for use in industrial applications in aqueous and non-aqueous fluids. Particularly suitable in threaded assembly applications that require immediate use and may undergo small readjustments before use. This product is typically used in applications up to 149 °C.

LOCTITE® 577™ is designed for the locking and sealing of metal threaded pipes and fittings. Particularly suitable for use on stainless steel without the need for surface activation.

LOCTITE® EA 9497™ is a medium viscosity, two component,room temperature curing epoxy adhisive that bonds a wide variety of materials making it suitable as a general purpose adhesive.

LOCTITE® LB 8008 C5-A™ provides a shield against high temperature seizing and galling. All mated parts, studs, bolts, flanges and gaskets, remove more easily and in cleaner and better condition.

LOCTITE®FREKOTE 55NC™ is a release agent where a non-transferring release is necessary.

H400 sealant tape is a high temperature sealant tape, this product has good temperature resistance, suitable for a variety of vacuum forming process. However, the initial viscosity of H400 is low, we should use H230 sealant tape at below 230℃ to insure the vacuum of the mold.