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Silicone and polymer-containing defoamer/air release additive for solvent-borne and solvent-free coatings, for plastic systems (ambient-curing and pultrusion applications), adhesives and sealants.
Particularly recommended for epoxy resin systems.
| Density (20 °C): | Refractive index (20 °C): |
| 0.86g/ml | 1.475 |
| Composition: | Typical Properties: |
| Solution of foam-destroying polymers, silicone-free | The values indicated in this data sheet describe typical properties and do not constitute specification limits. |
| Applications | |
1）Ambient-curing Plastic Systems 2）Adhesives & Sealants 3）Coatings Industry Special Features and Benefits： BYK-A 535 is particularly suitable for solvent-free systems such as polyurethane and epoxy coatings. It prevents air bubbles and pinholes. BYK-A 535 may cause cloudiness in transparent systems.
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