Description

NPCN-704 is an o-cresol epoxy resin from Nan Ya, built on a heat-resistant benzene ring backbone with multifunctional epoxy groups. This structure gives it a high crosslink (bridging) density and a wide processing window. Unlike a standard bisphenol-A resin with two epoxy groups per molecule (see NPEL-127/128 on this site), NPCN-704's novolac structure carries multiple epoxy groups along the chain, which is what drives its higher heat resistance and crosslink density.

NPCN-704 can be cured with polyamine, phenolic, or polyester resins, or with various acid anhydrides, to produce high-performance circuit board substrates (prepreg) or composite materials. The resulting cured substrate has a high glass transition temperature (Tg) along with good heat and chemical resistance.

Basic properties of resin

Chemical Composition

o-Cresol epoxy resin

Application

NPCN-704 is used in PC inks, composite materials, and powder coatings.